Building a stronger European semiconductor ecosystem with the European Network of Chips Competence Centers
About aCCCess
aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) is a four-year Coordination and Support Action launched in March 2025 under the EU Chips Act. It aims to build a strong, interconnected European Network of Chips Competence Centres (ENCCC) that enables innovation, facilitates access to advanced semiconductor services, and strengthens Europe’s position in the global semiconductor value chain.
Network
Our network is comprised of Chip Competence Centers, Pilot lines and Design Platforms. Together, PLs and the DP empower the CCCs with cutting-edge infrastructure.
What is a Competence Center?
A Chips Competence Centre (CCC) is a hub of excellence providing access to specialised semiconductor knowledge, training, prototyping, testing, and small-scale production. These centres are pivotal to Europe's semiconductor strategy by:
- Supporting SMEs and start-ups with innovation services
- Bridging the gap between research and industry
- Promoting regional and pan-European know-how in chips and microelectronics
What is a Pilot Line & a Design Platform?
Pilot Lines (PLs) are advanced manufacturing facilities that help scale innovations from research to production, enabling validation in relevant environments.
The Design Platform (DP) is a cloud-based virtual environment providing state-of-the-art Electronic Design Automation (EDA) tools and design libraries to:
- Accelerate chip design and prototyping
- Enable collaboration across Europe
- Support education and skills development in semiconductor design
Latest News
Training videos on YouTube
Upskill yourself for free with the learning videos produced by the Austrian Chips Competence Center. The first are already available on YouTube and will later be part of a full online course....
Chips Venture Forum 2025 Award... and the winner is Vertical Compute
The Chips Venture Forum 2025, organised by aCCCess and operated by Blumorpho in collaboration with the European Innovation Council and the European Commission, concluded on the 18 November 2025 at Messe Munich alongside SEMICON Europa bringing together Europes most promising semiconductor innovators and leading deep-tech investors....
Chips Venture Forum
Are you building the future of semiconductors, AI-powered systems, advanced materials, or edge computing? Benefit from the strengths of Competence Centres across Europe by joining a vibrant ecosystem of innovators and key stakeholders. This is your chance to accelerate your ideas and connect with experts in the semiconductor value chain....
Events
Chips Think Tank Webinar-4
Jan 20, 2026 13:00 CETJan 20, 2026 14:00 CET
Webinar
### Chips Think Tank Webinar 4: ## Energy-Efficient AI: The Coming Breakthrough in Compute Acceleration As artificial intelligence moves from large-scale training toward real-time, energy-efficient inference, new computing architectures are emerging, reshaping the foundations of the AI market and opening new opportunities for engineers, innovators, decision-makers, and strategists. Following the success of...
Event hosted by
4th Slovenian conference on chips and semiconductors
Jan 22, 2026 11:00 CETJan 22, 2026 19:00 CET
Faculty of Electrical Engineering, University of Ljubljana Trzaska cesta 25, 1000 Ljubljana, Slovenia
The SLO chip 2026 conference provides an opportunity to gain insights into semiconductor technologies and chip manufacturing, as well as the latest trends in micro-, nano-, and quantum electronics and recent achievements in the research and development of chips and semiconductors. Researchers, lecturers, engineers, industry experts, and other professionals active...
Event hosted by
FAMES European FD-SOI Design School (EFDS)
Jan 25, 2026 09:00 CETJan 30, 2026 17:00 CET
CIME Nanotech and CEA-Leti Grenoble, France
The FAMES European FD-SOI Design School (EFDS) is a one-week theoretical and practical training course focused on FD-SOI design. This course is intended for chip designers, engineers, Masters and PhD students, with the purpose of providing the essential scientific and technical foundations for developing integrated circuits using FD-SOI technology. ...
Event hosted by
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aCCCess has received funding from the European Union’s Digital Europe Chips JU under Grant Agreement No 101217840.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or [name of the granting authority]. Neither the European Union nor the granting authority can be held responsible for them.